curamik®金属化陶瓷基板

Rogers curamik® product suite offers best-in-class metallized ceramic substrates that enable higher power efficiency. Our curamik® substrates consist of pure copper bonded or brazed to a ceramic substrate and are designed to carry higher currents, provide higher voltage isolation and operate over a wide temperature range.

Our curamik Ceramic substrates offer high heat conductivity, high heat capacity and thermal spreading of the substrates' thick copper cladding, making our substrates indispensable to power electronics. The low coefficient of thermal expansion of the ceramic substrate means they outperform substrates based on metal or plastic.

好处

具有良好的导热性和耐温性
高绝缘电压
高热扩散
Low coefficient of thermal expansion outperforms metal or plastic substrates
Adjusted expansion coefficient enables chip on board
Efficient processing of master cards and single pieces
Range of formulations optimized for various power applications

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curamik®耐力

可用于多种陶瓷类型，包括铝₂O₃ ， HPS (ZTA)， AlN
Enhanced reliability performance compared to material combinations of the same dimensions

curamik®性能

基于Si₃N₄ 陶瓷 and produced in Active Metal Brazed (AMB) process
Used in applications where long lifetime, high power density and robustness are required
提供90 W/m K @ 20°C的导热系数
可提供6种厚度组合
CTE为2.5 ppm/K @ 20°C - 300°C

curamik®权力

Al₂O₃ 提供最佳的性价比
Offers sufficient thermal and mechanical properties for the most common applications
提供24 W/m K @ 20°C的导热系数
可在许多厚度组合
CTE为6.8 ppm/K @ 20°C - 300°C

curamik®Power Plus

HPS substrates provide enhanced robustness through Zr doped Al₂O₃ 陶瓷
用于中功率输出应用
提供26 W/m K @ 20°C的导热系数
可在许多厚度组合
CTE为7.1 ppm/K @ 20°C - 300°C

curamik®热

Based on AlN 陶瓷 and combines excellent thermal conductivity with good mechanical stability
Used in very high operational voltage and power density applications
提供热导率170 W/m K @ 20°C
可在许多厚度组合
CTE为4.7 ppm/K @ 20°C - 300°C

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奥利维尔的扭曲博客

This monthly blog is contributed to by Olivier Mathieu and other experts from Rogers' Power Electronics Solutions, providing technical advice and information about advanced materials technologies that increase efficiency, 管理热量，确保质量和可靠性.

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